Epoxy Adhesive 1E31-G
General purpose adhesive or encapsulant. Medium viscosity with 1:1 mix ratio. Medium hardness with good flexibility. Wide range of applications with bonding capabilities to multiple substrates.
Request Data Sheets | Free Sample
| Chemistry | Epoxy |
| Viscosity Part A (CPs) | Thixotropic |
| Viscosity Part B (CPs) | |
| Mix Ratio | |
| Pot Life (min)* | Until exposed to heat |
| Handling Time (min)* | |
| Full Cure** | 2 hr @ 120oC |
| Cure Type | Heat |
| Color | Silver |
| Hardness | D80 |
| Operating Temp (°C) | -20 to 150 C |
| Applications | Solder Replacement |
| Substrates | Metals, plastics |
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